Component Placement and Reflow
SPECTRUM uses a Speedline high precision stencil printer and Assembleon automated placement systems. Solder paste volume is measured/verified using a Microtec Z600.
Vapor Phase or convection oven reflow is used depending on the customer. All Bottom Terminated Components are x-ray inspected after reflow.
Replacement and Repair
BGA/LGA/CGA/QFN replacement is accomplished using rework systems by Metcal and SRT Sierra, or manually using hot air.
Spectrum