BGA / LGA /CGA / QFN / Placement, Attach, Rework, and Repair

Component Placement and Reflow

SPECTRUM uses a Speedline high precision stencil printer and Assembleon automated placement systems.  Solder paste volume is measured/verified using a Microtec Z600.

Vapor Phase or convection oven reflow is used depending on the customer.  All Bottom Terminated Components are x-ray inspected after reflow.

Replacement and Repair

BGA/LGA/CGA/QFN replacement is accomplished using rework systems by Metcal and SRT Sierra, or manually using hot air.