Vapor Phase Reflow
SPECTRUM is a proponent of vapor phase reflow soldering for effective and reliable BGA/LGA/CGA attachment. Maximum temperature exposures can be precisely controlled based upon the vaporization temperature of the liquid used.
Our ASSCON VP 450 and VP 800 Vapor Phase Reflow systems provide options in reflow temperatures. Where required, several different solder alloys can be used on the same Printed Wiring Board, allowing a second reflow without re-reflowing previously soldered components/interconnects.